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April 26,
2010
StackableUSB™
Standards Organization Moves to Incorporate USB 3.0
Montrose, CA... As
StackableUSB gains market recognition in the embedded, sensor, military and
robotic industries, Chairperson Susan Wooley has announced the organization is
moving forward with the approval of a single USB 3.0 channel inside the popular
StackableUSB connector. By defining pins which had "quietly" been left
undefined, the USB 3.0 channel will enable the StackableUSB connector to
deliver actual throughput greater than 5 Gbits/sec which is 10 times the speed
of a single Hi-Speed USB channel. With this announcement, StackableUSB gains
throughput similar to PCIe Gen 2.0 and Serail ATA (SATA) III without the burden
of mixing these very complex and distinctly different protocols inside a single
connector.
While being
electrically and mechanically backward compatible with USB 2.0, USB 3.0 has
features which match well with StackableUSB and embedded applications in
general. USB 3.0 supports the more efficient asynchronous transfer model which
is particularly well suited to industrial applications and ROTS systems. USB
3.0 allows devices to draw up to 900mA which is a feature StackableUSB has
incorporated from its beginnings. Additionally, USB 3.0 implements power saving
techniques which are important to embedded users, such as allowing inactive
devices to remain in low-power states and charging over USB.
Embedded applications requiring fast transfer rates of large volumes of data to
external storage devices or applications transferring video will be the initial
benefactors of USB 3.0 SuperSpeed. Design engineers will gain the advantage of
USB 3.0’s increased bandwidth, ubiquity, and ability to provide content
protection. This stated, USB 2.0 is still the mainstay of embedded development
and applications today. The significance of this adoption of USB 3.0 by
StackableUSB lies in the roadmap it provides users into the future. Users of
StackableUSB can rest comfortably knowing the electrical and mechanical
board-to-board communication standard they are building their products around
today is "forward-compatible" with the evolution of embedded chips, sensors and
software. StackableUSB will support USB 3.0 and additional technological
advances in the same manner USB 2.0 is supported today.
About StackableUSB:
StackableUSB ruggedizes USB, I2C, and SPI into compact form factors enabling
the technology to move into harsh environments such as industrial control
systems, mobile, hand-held, military, medical, and remote communications
applications. Visit www.StackableUSB.org for more information on StackableUSB
and its ability to increase throughput as technology advances.
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